In recent years, the demand for lightning protection and ESD electrostatic protection components in the market can be roughly divided into two development directions. One is the decreasing equivalent capacitance, which is due to the accelerated development of various transmission ports in recent years, driving the bandwidth to become larger and faster. For example, the data transmission speed of USB 3.0 reaches 5Gbps, which is ten times faster than the existing USB 2.0; The data transmission speed of Thunderbolt is as high as 10Gbps, making the equivalent capacitance requirements for ESD electrostatic protection components increasingly stringent for clients. For protective component manufacturers, reducing equivalent capacitance has become the main direction of technological development for their products.

Another major trend is miniaturization packaging. The trend towards miniaturization packaging, as well as the trend towards miniaturization of lightning protection and ESD electrostatic protection components, is becoming increasingly evident. Especially with the booming development of products such as ultrabooks, tablets, and smartphones, it is becoming increasingly urgent for clients to meet this demand. The demand for SOT-26 is gradually shifting towards SOT-363, and even packaged products such as SOT563. In addition, from the Bill of Materials (BOM) of mobile phone customers, it can be seen that there is a demand for packaging from DFN1006 to smaller DFN0603, indicating a trend towards miniaturization.

The low capacitance ESD product launched by Prisemi with a capacitance value of<0.5pf is the mainstream low capacitance ESD protection product in the market, and ESD products with a capacitance value of<0.1pf will be launched in the future.

In response to the trend of miniaturization, Prisemi has recently launched a full range of ESD protection devices in DFN0603 packaging. The packaging size is only 0.6 x 0.3 x 0.3 millimeters, which saves about 66% of circuit board space compared to similar products using industry standard DFN1006 and SOD923 packaging. In addition, the DFN0603 package is 25% thinner than similar packages, giving it an advantage in off board thickness.